Author Archives: R. Smith

Ceramic-Metal Bonding: Metalization of Ceramics, Vacuum Seals

The joining of ceramics to metals creates its own engineering challenges that require specialist expertise. Morgan Technical Ceramics are favored in a wide range of electronics and engineering applications for their chemical and mechanical properties. Compared to metals, they are stronger in compression, especially at higher temperatures, they have a good thermal stability (i.e. a […]

Graphite and Carbon Bonded to Metals

Graphite bonding and carbon bonding is another aspect of ceramic to metal bonding in that carbon with its allotropes, has a range of crystalline structure that can resemble ceramic. Most engineered ceramic are covalently bonded and as such are not as easy to react with as other metals. For example, graphite is ‘partially covalently bonded” […]

Silicon Carbide (SiC) to Metal Joining

As the cost of producing SiC ceramic and as the technology to “cast” complex parts with SiSiC composite ceramics matures, there is increasing applications for bonding SiC based ceramics to metals. Applications are expanding in electronics (LED’s and semiconductors), optical mirrors, energy production and aerospace.           The challenge in many of […]

Sapphire to Metal Hermetic Seals

We get many calls about hermetically sealing sapphire (single crystal aluminum oxide) to metal flanges and this post addresses some of the applicable commercial methods used.  Sapphire to metal seals many times are used in sensor housing like those seen in Figure 1. In this application these titanium housing are actively soldered (S-Bond) to the […]


Welcome to this technical forum for ceramic-metal bonding. S-Bond Technologies is pleased to present and offer this technical discussion forum dedicate to the ceramic:metal bonding. Ceramic:metal bonding has been used extensively in industry anywhere from wear surfaces to electronics. With the increasing demands on materials and their performance in a host of applications including sensors, […]

Service Conditions and Ceramic: Metals Joint Behavior

177226931Ceramic:metal bonding is done in many applications from propulsion and turbine components, electronic packaging, electrical power components, batteries, sensors, sensor housings, wear inserts, medical surgical components, insulating feeds, etc. These varied applications also mean widely varying performance requirements and service conditions. This lead off discussion thread is to get us all thinking about performance and service and to present materials, design and commercial solutions that have been considered, used… offering case studies or other articles that permit our community insight into issues and solutions.

To get this discussion started I will highlight function and considerations in selecting ceramic:metal bonding.

Compatible Filler Metals for Joining Ceramic

When joining ceramic to metals a lot factors need to be considered… First is always the expected service environment, temperature and thermal cycling. Second is the ceramic and the metal materials being joined. And third, the size and geometry of the joint. Ceramic:metal bonding does require careful analysis of the chemistry of the materials and […]

Accomodating Thermal Expansion Mismatch

Metal fillers (solders and brazes) can join a wide variety of materials, including aluminum, copper, stainless steel, refractory metals with aluminum oxide, aluminum nitride, silicon carbide and other oxide, nitrides and carbides… However, the success of bonding ceramic to metals depends on the exact ceramic and metal materials and the joined assembly size and geometry. […]